RE: [16NG] multiple encapsulation issue

Daniel Park <soohong.park@samsung.com> Fri, 30 March 2007 04:51 UTC

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Date: Fri, 30 Mar 2007 13:50:04 +0900
From: Daniel Park <soohong.park@samsung.com>
Subject: RE: [16NG] multiple encapsulation issue
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Ok folks, I've seen lot of interest regarding this stuff.
I've formed a new closed mailing list for further discussion
with several volunteers. Thanks all of volunteers.

Hopefully, we will show up the result of this work in
Chicago.

-- Daniel Park

> -----Original Message-----
> From: Daniel Park [mailto:soohongp@gmail.com] 
> Sent: Thursday, March 15, 2007 1:06 AM
> To: 16ng@ietf.org
> Subject: [16NG] multiple encapsulation issue
> 
> Folks,
> 
> As you are aware of, IAB is in the progress of spelling out multiple
> encapsulation considerations. The latest publication is
> draft-iab-link-encaps-08. It indicates lot of considerations to the
> usage of 802.16 multiple convergence sublayers. I am thinking of
> dealing with this issue in this list more detail and precise than now.
> I believe it would be valuable effort at this stage prior to moving
> this document forward.
> 
> What do you think ?
> 
> Question 1: Are you thinking that we need to do this in 16ng ?
> If yes, go to Question 2
> If no, let me know why
> 
> Question 2: How many folks are willing to work on that together ?
> Most activities are to analyze IAB document first and make a clear
> answer to all of considerations. If necessary, drafting would be good
> for folks information.
> 
> Results will be shown at the next meeting in Chicago hopefully.
> 
> -- 
> 
> 
> Daniel (Soohong Daniel Park)
> Mobile Convergence Laboratory, SAMSUNG Electronics.
> 
> _______________________________________________
> 16NG mailing list
> 16NG@ietf.org
> https://www1.ietf.org/mailman/listinfo/16ng
> 
> 


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