[Dime] IPR Disclosure Huawei Technologies Co., Ltd's Statement about IPR related to RFC 6737
IETF Secretariat <ietf-ipr@ietf.org> Mon, 11 February 2019 16:02 UTC
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From: IETF Secretariat <ietf-ipr@ietf.org>
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Date: Mon, 11 Feb 2019 08:02:50 -0800
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Subject: [Dime] IPR Disclosure Huawei Technologies Co., Ltd's Statement about IPR related to RFC 6737
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Dear Glen Zorn, Jiao Kang: An IPR disclosure that pertains to your RFC entitled "The Diameter Capabilities Update Application" (RFC6737) was submitted to the IETF Secretariat on and has been posted on the "IETF Page of Intellectual Property Rights Disclosures" (https://datatracker.ietf.org/ipr/3421/). The title of the IPR disclosure is "Huawei Technologies Co.,Ltd's Statement about IPR related to RFC 6737" Thank you IETF Secretariat
- [Dime] IPR Disclosure Huawei Technologies Co., Lt… IETF Secretariat