[Dime] IPR Disclosure Huawei Technologies Co., Ltd's Statement about IPR related to RFC 6737

IETF Secretariat <ietf-ipr@ietf.org> Mon, 11 February 2019 16:02 UTC

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From: IETF Secretariat <ietf-ipr@ietf.org>
To: draft-ietf-dime-capablities-update@ietf.org
Cc: dime@ietf.org, ipr-announce@ietf.org
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Message-ID: <154990097096.29544.14655506851310972297@ietfa.amsl.com>
Date: Mon, 11 Feb 2019 08:02:50 -0800
Archived-At: <https://mailarchive.ietf.org/arch/msg/dime/0CLO-_hVtXCPbdsbX7qCa3VBF4c>
Subject: [Dime] IPR Disclosure Huawei Technologies Co., Ltd's Statement about IPR related to RFC 6737

Dear Glen Zorn, Jiao Kang:


An IPR disclosure that pertains to your RFC entitled "The Diameter
Capabilities Update Application" (RFC6737) was submitted to the IETF
Secretariat on  and has been posted on the "IETF Page of Intellectual
Property Rights Disclosures" (https://datatracker.ietf.org/ipr/3421/) The
title of the IPR disclosure is "Huawei Technologies Co.,Ltd's Statement
about IPR related to RFC 6737"


Thank you

IETF Secretariat

[Dime] IPR Disclosure Huawei Technologies Co., Lt… IETF Secretariat