Re: [Plus] New Version Notification for draft-trammell-plus-spec-00.txt

[Mirja Kühlewind <[e-mail]>]

Hi all,

we submitted (just before Christmas) a new draft proposing a common wire image for UDP substrates. Based on the previous discussion on the list, the proposal follows the simpler approach of using a random serial number and highest number echo for basic diagnostics. In addition, we discuss further diagnostic information that could be provided by an extended header without proposing a extended header format yet. 
Stay tuned for further updates and please provide input or feedback! Thanks!

Happy new year!
Mirja


> Am 23.12.2016 um 15:28 schrieb [e-mail]:
> 
> 
> A new version of I-D, draft-trammell-plus-spec-00.txt
> has been successfully submitted by Brian Trammell and posted to the
> IETF repository.
> 
> Name:		draft-trammell-plus-spec
> Revision:	00
> Title:		Path Layer UDP Substrate Specification
> Document date:	2016-12-23
> Group:		Individual Submission
> Pages:		13
> URL:            https://www.ietf.org/internet-drafts/draft-trammell-plus-spec-00.txt
> Status:         https://datatracker.ietf.org/doc/draft-trammell-plus-spec/
> Htmlized:       https://tools.ietf.org/html/draft-trammell-plus-spec-00
> 
> 
> Abstract:
>   This document specifies a common Path Layer UDP Substrate (PLUS) wire
>   image for encrypted transport protocols carried over UDP.  The base
>   PLUS header carries information for driving a minimal state machine
>   at middleboxes described in [I-D.trammell-plus-statefulness], and
>   provides optional exposure of additional information to devices along
>   the path using the mechanism described in
>   [I-D.trammell-plus-abstract-mech].
> 
> 
> 
> 
> Please note that it may take a couple of minutes from the time of submission
> until the htmlized version and diff are available at tools.ietf.org.
> 
> The IETF Secretariat