Re: [Plus] New Version Notification for draft-trammell-plus-spec-00.txt

"Fossati, Thomas (Nokia - GB)" <> Fri, 06 January 2017 17:46 UTC

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From: "Fossati, Thomas (Nokia - GB)" <>
To: Mirja Kühlewind <>, "" <>
Thread-Topic: [Plus] New Version Notification for draft-trammell-plus-spec-00.txt
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Date: Fri, 06 Jan 2017 17:40:03 +0000
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Subject: Re: [Plus] New Version Notification for draft-trammell-plus-spec-00.txt
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Hi Mirja,

On 05/01/2017 10:44, "Plus on behalf of Mirja Kühlewind"
< on behalf of> wrote:
>we submitted (just before Christmas) a new draft proposing a common wire
>image for UDP substrates. Based on the previous discussion on the list,
>the proposal follows the simpler approach of using a random serial number
>and highest number echo for basic diagnostics. In addition, we discuss
>further diagnostic information that could be provided by an extended
>header without proposing a extended header format yet.
>Stay tuned for further updates and please provide input or feedback!

I've just finished reading the draft and was extremely pleased to see the
LoLa bit in the basic header.  An end-to-end integrity-protected marking
is definitely better than DSCP.

It also look pretty straightforward to add a couple of PCFs to the
extended header to support MTG signalling, which is nice.

A few editorial nits:
Sec 2.1, second bullet: "When multiplexing, it must ensure the PSN is not
already in use for the 5-tuple." -- you probably mean CAT instead of PSN?
Sec 2.2, second bullet: "It verifies the integrity of the information in
the PLUS Basic Header, using information carried in the overlying
transport." -- it's not clear which "information carried in the overlying
transport" you are referring to.
Sec 2.3.1, first para -- a bit hard to parse.

One meta-comment: how do you think the use of PLUS is negotiated by the

Cheers, t

>Happy new year!
>> Am 23.12.2016 um 15:28 schrieb
>> A new version of I-D, draft-trammell-plus-spec-00.txt
>> has been successfully submitted by Brian Trammell and posted to the
>> IETF repository.
>> Name:		draft-trammell-plus-spec
>> Revision:	00
>> Title:		Path Layer UDP Substrate Specification
>> Document date:	2016-12-23
>> Group:		Individual Submission
>> Pages:		13
>> URL:            
>> Status:         
>> Htmlized:
>> Abstract:
>>   This document specifies a common Path Layer UDP Substrate (PLUS) wire
>>   image for encrypted transport protocols carried over UDP.  The base
>>   PLUS header carries information for driving a minimal state machine
>>   at middleboxes described in [I-D.trammell-plus-statefulness], and
>>   provides optional exposure of additional information to devices along
>>   the path using the mechanism described in
>>   [I-D.trammell-plus-abstract-mech].
>> Please note that it may take a couple of minutes from the time of
>> until the htmlized version and diff are available at
>> The IETF Secretariat
>Plus mailing list