Re: [Plus] New Version Notification for draft-trammell-plus-spec-00.txt

["Fossati, Thomas (Nokia - GB)" <[e-mail]>]

Hi Mirja,

On 05/01/2017 10:44, "Plus on behalf of Mirja Kühlewind"
<[e-mail] on behalf of [e-mail]> wrote:
>we submitted (just before Christmas) a new draft proposing a common wire
>image for UDP substrates. Based on the previous discussion on the list,
>the proposal follows the simpler approach of using a random serial number
>and highest number echo for basic diagnostics. In addition, we discuss
>further diagnostic information that could be provided by an extended
>header without proposing a extended header format yet.
>Stay tuned for further updates and please provide input or feedback!
>Thanks!

I've just finished reading the draft and was extremely pleased to see the
LoLa bit in the basic header.  An end-to-end integrity-protected marking
is definitely better than DSCP.

It also look pretty straightforward to add a couple of PCFs to the
extended header to support MTG signalling, which is nice.

A few editorial nits:
Sec 2.1, second bullet: "When multiplexing, it must ensure the PSN is not
already in use for the 5-tuple." -- you probably mean CAT instead of PSN?
Sec 2.2, second bullet: "It verifies the integrity of the information in
the PLUS Basic Header, using information carried in the overlying
transport." -- it's not clear which "information carried in the overlying
transport" you are referring to.
Sec 2.3.1, first para -- a bit hard to parse.

One meta-comment: how do you think the use of PLUS is negotiated by the
endpoints?

Cheers, t


>Happy new year!
>Mirja
>
>
>> Am 23.12.2016 um 15:28 schrieb [e-mail]:
>> 
>> 
>> A new version of I-D, draft-trammell-plus-spec-00.txt
>> has been successfully submitted by Brian Trammell and posted to the
>> IETF repository.
>> 
>> Name:		draft-trammell-plus-spec
>> Revision:	00
>> Title:		Path Layer UDP Substrate Specification
>> Document date:	2016-12-23
>> Group:		Individual Submission
>> Pages:		13
>> URL:            
>>https://www.ietf.org/internet-drafts/draft-trammell-plus-spec-00.txt
>> Status:         
>>https://datatracker.ietf.org/doc/draft-trammell-plus-spec/
>> Htmlized:       https://tools.ietf.org/html/draft-trammell-plus-spec-00
>> 
>> 
>> Abstract:
>>   This document specifies a common Path Layer UDP Substrate (PLUS) wire
>>   image for encrypted transport protocols carried over UDP.  The base
>>   PLUS header carries information for driving a minimal state machine
>>   at middleboxes described in [I-D.trammell-plus-statefulness], and
>>   provides optional exposure of additional information to devices along
>>   the path using the mechanism described in
>>   [I-D.trammell-plus-abstract-mech].
>> 
>> 
>> 
>> 
>> Please note that it may take a couple of minutes from the time of
>>submission
>> until the htmlized version and diff are available at tools.ietf.org.
>> 
>> The IETF Secretariat
>
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