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RE: WG adoption for draft-hu-rtgwg-srv6-egress-protection

Huzhibo <huzhibo@huawei.com> Fri, 21 February 2020 06:30 UTC

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From: Huzhibo <huzhibo@huawei.com>
To: Jeff Tantsura <jefftant.ietf@gmail.com>, RTGWG <rtgwg@ietf.org>, Routing WG <rtgwg-chairs@ietf.org>
Subject: RE: WG adoption for draft-hu-rtgwg-srv6-egress-protection
Thread-Topic: WG adoption for draft-hu-rtgwg-srv6-egress-protection
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Date: Fri, 21 Feb 2020 06:29:58 +0000
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Dear RTGWG,

Support as a co-author. There is a Patent application related to the draft and in the process of IPR disclosure.

Thanks

Zhibo Hu
From: rtgwg [mailto:rtgwg-bounces@ietf.org] On Behalf Of Jeff Tantsura
Sent: Friday, February 21, 2020 3:02 AM
To: RTGWG <rtgwg@ietf.org>; Routing WG <rtgwg-chairs@ietf.org>
Subject: WG adoption for draft-hu-rtgwg-srv6-egress-protection

Dear RTGWG,

The authors have requested RTGWG to adopt draft-hu-rtgwg-srv6-egress-protection as the working group document.
The draft has received support during IETF106 meeting, authors have addressed all the comments received, I expect new version that addresses latest comments from Yimin to be uploaded within few days.

Please indicate support or no-support by April 5, 2020.

If you are listed as a document author or contributor please respond to this
email stating of whether or not you are aware of any relevant IPR.
The response needs to be sent to the RTGWG mailing list. The document will not
advance to the next stage until a response has been received from each
author and each individual that has contributed to the document.

Cheers,
Jeff & Chris

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