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Re: [spring] SRv6 compression

linchangwang <linchangwang.04414@h3c.com> Mon, 02 August 2021 11:42 UTC

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From: linchangwang <linchangwang.04414@h3c.com>
To: "spring@ietf.org" <spring@ietf.org>
Thread-Topic: [spring] SRv6 compression
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Date: Mon, 2 Aug 2021 11:41:59 +0000
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Subject: Re: [spring] SRv6 compression
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Hi All

Excellent work done by DT in the past year!
Many thanks for DT's hard work completing SRv6 header compression requirements and solutions comparion.
I hop the solution is the one that has been implemented by the most vendors in the world, which is CSID.

Best Regards,
Changwang


发件人: spring [mailto:spring-bounces@ietf.org] 代表 li_zhenqiang@hotmail.com
发送时间: 2021年7月31日 16:38
收件人: Henderickx, Wim (Nokia - BE/Antwerp); spring@ietf.org
主题: Re: [spring] SRv6 compression

Agree. Picking 1 solution to satisfy our requirements will benefit both the vendors and the operators.

Best Regards,
Zhenqiang Li
________________________________
li_zhenqiang@hotmail.com

From: Henderickx, Wim (Nokia - BE/Antwerp)<mailto:wim.henderickx@nokia.com>
Date: 2021-07-27 15:11
To: spring@ietf.org<mailto:spring@ietf.org>
Subject: [spring] SRv6 compression
Given the design team accomplished the work on providing requirements and analysis to compress an SRv6 SID list, I would recommend we pick 1 solution similar to what was done in NVO3 (when we discussed GENEVE, GUE, GPE, etc) given this has to be implemented in HW..

I hope we can conclude on this asap and move forward on this topic

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