[hackathon] new project Tie Die
Eliot Lear <lear@lear.ch> Thu, 02 November 2023 13:45 UTC
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Date: Thu, 02 Nov 2023 14:45:23 +0100
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To: hackathon <hackathon@ietf.org>
From: Eliot Lear <lear@lear.ch>
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Subject: [hackathon] new project Tie Die
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Hi everyone, A few of us have been tooling around on a project called Tie Die. It's about provisioning IoT devices into the network and providing a communications channel to them using an application layer gateway, with at least the initial idea being that it is works with existing standards like BLE, Zigbee, etc. So we're going to be hacking on it. If you have a BLE device that has an open interface, bring it along and we might be able to do something with it. The code can be found at https://github.com/iot-onboarding/tiedie. Contributions are welcome, as discussed in CONTRIBUTING.md. The drafts: * draft-ietf-scim-devices * draft-brinckman-nipc (non-ip control) Coders wanted! Eliot
- [hackathon] new project Tie Die Eliot Lear