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Re: [spring] Thoughts on optimality

Bob Hinden <bob.hinden@gmail.com> Sat, 18 September 2021 16:28 UTC

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From: Bob Hinden <bob.hinden@gmail.com>
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Date: Sat, 18 Sep 2021 09:28:38 -0700
In-Reply-To: <7F1F9A33-38C8-4F89-9AE2-05E64C6DCF5C@tony.li>
Cc: Bob Hinden <bob.hinden@gmail.com>, Tony Li <tony.li@tony.li>
To: spring <spring@ietf.org>
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Subject: Re: [spring] Thoughts on optimality
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Hi,

I think Tony makes an excellent point.   The main purpose of this work is to compress the SRv6 header.  I agree with Tony that the w.g. should focus on the solution that provides the best header compression.

Bob


> On Sep 16, 2021, at 3:23 PM, Tony Li <tony.li@tony.li> wrote:
> 
> 
> Hi all,
> 
> We now seem headed to be adopting both the requirements and analysis drafts and thoughts start to turn towards the debate for selection.
> 
> The requirements draft has done a good job documenting our requirements and the analysis draft gives us a perspective on how the various proposals fulfill those requirements, but a deeper nuance is needed to guide us to making an optimal choice.
> 
> To that end, it seems to me that three of the requirements are paramount:
> 
> - Encapsulation Header Size
> - Forwarding Efficiency
> - State Efficiency
> 
> Of these three, Forwarding Efficiency and State Efficiency seem like they will be overcome by hardware technology.  Continued growth in semiconductors will help us scale here, so the remaing requirement of the Encapsulation Header Size would seem to predominate, and we should therefore optimize for that.
> 
> Regards,
> Tony
> 
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